News
According to news from the Semiconductor Industry Network, on November 19, the 2025 Intel Technology Innovation and Industry Ecosystem Conference opened in Chongqing. Intel CEO Chen Lifu delivered a public speech.
During the conference, Intel announced that its 18A process technology has entered mass production at the Fab 52 facility in Arizona. This process adopts Gate-All-Around Transistor technology and Backside Power Delivery technology, achieving dual advancements in energy efficiency and density.
Compared to the previous generation process, the 18A technology delivers:
15% performance improvement at the same power consumption
30% increase in transistor density
Intel stated that this technology serves as the cornerstone for Intel’s next three generations of technology, and the company is rapidly advancing the development of subsequent products based on this foundation.
